Shipments Of 3D Sensing Components For Smartphones Picking Up

Taiwan-based makers in the 3D sensing components supply chain, including VCSEL suppliers and 3D packaging firms, have seen their shipments start picking up recently after a slowdown in June-July caused by inventory adjustments at clients, according to industry sources.

Since Taiwan’s 3D sensing component makers are mostly offering customized services to major clients, their shipments would be affected if sales of clients’ products such as the iPhone X were lower than expected, said the sources.

As a result, Tong Hsing Electric Industries and Xintec, both of which offer backend packaging services for 3D optical sensing components such as diffraction optical element (DOV) products for smatphones, suffered slower sales for the segment during the June-July period, the sources noted.

However, sources at Xintec said that they expect orders for customized 3D sensing optical products to increase significantly in the third quarter after hitting a trough in the second quarter.

The forthcoming next-generation iPhone devices, which are widely expected to feature 3D sensing technology, is expected to spur up demand for 3D sensing components starting the third quarter, added the sources.

Meanwhile, IC-design house Himax Technologies also expects shipments of its WLO (wafer level optics) lenses to expand substantially in the second half of 2018 as compared to those shipped in the first half. – Digitimes

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